What are the requirements and the development trend of Dongguan Board-to-Board Connectors die?
In recent years, with the development of electronic products to high technology, miniaturization and high performance of the trend, the people are also getting to Dongguan Board-to-Board Connectors is high, board to board connector mold enterprises are facing challenges and technical requirements more and more high. Let's take a look at it today.
First, we need to have a higher level of mold design, because of the different shapes of terminals, plate to board connectors have no structure, how to design properly is very important, if the structure is unreasonable, will lead to substandard products;
Second, high-precision equipment, board to board connector terminals require processing equipment, high precision, foreign equipment accuracy can reach + 0.002mm, and the general domestic equipment can only reach + 0.01mm;
Third, it is a good basic processing technology. A good Board-to-Board Connectors mold requires the perfect combination of design, equipment, and process in three ways. At the same time, the supporting equipment requires high technical barriers is relatively high, using advanced CNC plane Guosheng mill, automatic optical curve grinding, wire cutting, machining center and other equipment combination, production.
Industry experts predict that in the push to board connector interface miniaturization, high data transmission rate trend in future, board to board connector tooling requirements will be more demanding, the board to board connector tooling equipment, material and quality requirements are higher, speed has reached the use of punch die 500 rpm -3000 rpm, which for mold enterprises, is undoubtedly a technical challenge. To make a space for one person to board connector industry in the board, board to board connector mold enterprises must step up the pace of industrial restructuring, increase scientific and technological innovation and capital investment, in order to produce to meet market demand, adapt to the development of the high performance board to board connector.
The above is a brief introduction to the requirements and development directions of Dongguan board to board connector die. Please refer to this website for details. Http://www.lxgchn.com